& make your SoC flexible for changing needs.
eFPGA proven on 6/7, 12, 16, 22, 28, 40 & 180nm.
Flex Logix™ Technology
Inference and eFPGA are both data flow architectures. A single inference layer can take over a billion multiply-accumulates. Our Reconfigurable Tensor Processor reconfigures the 64 TPUs and RAM resources to efficiently implement a layer with a full bandwidth, dedicated data path, like an ASIC; then repeats this layer by layer. Flex Logix utilizes a new breakthrough interconnect architecture: less than half the silicon area of traditional mesh interconnect, fewer metal layers, higher utilization and higher performance. The ISSCC 2014 paper detailing this technology won the ISSCC Lewis Winner Award for Outstanding Paper. The interconnect continues to be improved resulting in new patents.
We can easily scale up our Inference and eFPGA architectures to deliver compute capacity of any size. Flex Logix does this using a patented tiling architecture with interconnects at the edge of the tiles that automatically form a larger array of any size.
TIGHTLY COUPLED SRAM AND COMPUTE
SRAM closely couples with our compute tiles using another patented interconnect. Inference efficiency is achieved by closely coupling local SRAM with compute which is 100x more energy efficient than DRAM bandwidth. This interconnect is also useful for many eFPGA applications.
DYNAMIC TENSOR PROCESSOROur dynamic tensor processor features 64 one-dimensional tensor processors closely coupled with SRAM. The tensor processors are dynamically reconfigurable during runtime, using our proprietary interconnect, thus enabling implementation of multi-dimensional tensor operations as required for each layer of a neural network model, resulting in high utilization and high throughput.
SOFTWAREUnlike solutions designed around AI model development and training, our Inference accelerator starts with a trained ML model, typically in ONNX format and generates a program that runs on our InferX accelerators.
Our eFPGA compiler has been in use by dozens of customers for several years. Software drivers will be available for common Server OS and real time OS for MCUs and FPGAs.
InferX PCI Express and M.2 offeringsThe InferX X1 processor is in production and is available now in PCI Express (HHHL), M.2 (M+B key) and chip level offerings.
SUPERIOR LOW-POWER DESIGN METHODOLOGYFlex Logix has numerous architecture and circuit design technologies to deliver the highest throughput at the lowest power.
Flex Logix Launches EasyVision - Turnkey AI/ML Solution With Ready-to-Use Models and AI Acceleration Hardware
MOUNTAIN VIEW, Calif., June 6, 2022 /PRNewswire/ -- Flex Logix® Technologies, Inc., supplier of fast and efficient edge AI inference accelerators, announced today the availability of EasyVision Platforms designed to help customers get to market quickly with edge computer vision products for a wide range of markets such as robotic vision, industrial, security, and retail analytics. EasyVision features the industry's most efficient edge AI accelerator, the InferX™, along with ready-to-use models that are trained to perform the most common object detection capabilities such as hard-hat detection, people counting, face mask detection and license plate recognition.
Silicon Catalyst, the world’s only incubator focused exclusively on accelerating semiconductor solutions, is pleased to announce that Flex Logix® has joined as the newest member of its In-Kind Partner program (IKP). Portfolio companies in the Silicon Catalyst Incubator will have access to Flex Logix’s innovative embedded FPGA (eFPGA) IP and software, enabling silicon reconfigurability for use in their chip designs.
The availability of AI models optimized for the Flex Logix InferX accelerator enables edge device manufacturers to get to market quickly, reliably and affordably.