Edge AI Summit Day 2
10am Pacific Time: Cheng Wang will provide the latest update on InferX X1, the fastest and most efficient AI Edge Inference Chip and how it compares to popular alternatives for the Device Edge.
Edge AI Summit Day 2
10am Pacific Time: Cheng Wang will provide the latest update on InferX X1, the fastest and most efficient AI Edge Inference Chip and how it compares to popular alternatives for the Device Edge.
October 28, Flex Logix 发布 InferX X1 系列板卡技术路线图及配套软件
October 22, SemiWiki, Flex Logix Brings AI to the Masses with InferX X1
October 21, EE Times, Flex Logix’ Edge AI Accelerator Battles Nvidia on Price-Performance
October 22, EE Journal, Flex Logix joins the race to the inferencing edge.
October 21, EENews Europe, Flex Logix looks to 7nm for edge AI chip
October 20,FLEX LOGIX 推出最高性能、最高效率 AI 边缘推理芯片
October 8, SemiEngineering: Are FPGAs more secure than Processors?
October 8, SemiEngineering, One More Time: TOPS Do Not Predict Inference Throughput
September 14, SemiEngineering, VIDEO: Inference Accelerators, Apples vs Oranges
September 9, Kushagra Vaid Joins Flex Logix’s Board of Directors
September 3, SemiEngineering, Apples, Oranges & the Optimal AI Inference Accelerator
August 6, SemiEngineering, Performance Metrics for Convolutional Neural Network Accelerators
July 23, EE Times, AI Edge Inference is Totally Different to Data Center
July 22, Electronic Design, Inference Chips Benefit from a Concurrent Design Approach
July 15, SemiEngineering, Integrating FPGA: Comparison of Chiplets vs eFPGA
May 12, Electronic Design, 11 Myths about Inference Acceleration
May 11, SemiEngineering, Big Changes for eFPGAs
May 8, SemiWiki, Flex Logix CEO Update
May 7, SemiEngineering, Increasing eFPGA Adoption Will Shape eFPGA Features/Benefits
May 4, SemiEngineering: Key Drivers in New Chip Industry Outlooks
April 27, Microprocessor Report, Flex Logix Accelerates DSP
April 23, EE Times, Why Software is Critical for AI Inference Accelerators
April 22, Semiwiki, Accelerating Edge Inference
April 8, SemiEngineering Video: AI Inference, Pools vs Streams
April 7, Flex Logix Announces nnMAX IP Delivers Higher Throughput/$ and Higher Throughput/Watt for Key DSP Functions – see the presentation on our Inference page
April 2, SemiEngineering, AI Inference: Pools vs Streams, https://semiengineering.com/ai-inference-pools-vs-streams/
April 2, SemiEngineering, More Multiply-Accumulate Operations Everywhere, https://semiengineering.com/more-multiply-accumulate-operations-everywhere/
February 27, 2020, Semiconductor Engineering, The Challenges of Building Inferencing Chips
February 18, Embedded Computing Design, The Four Stages of Inference Benchmarking
February 10, 2020 Semiengineering: Video: The Importance of Software for Inference Accelerators
February 6, 2020, SemiEngineering: Software is at least as important as Hardware for AI Inference Accelerators
February 4, 2020, SemiEngineering: Defining and Improving AI Performance
January 9, SemiEngineering, Where is the eFPGA Market headed?
December 11, Dialog Semiconductor & Flex Logix Establish Strategic Partnership for Mixed Signal eFPGAs: Increasing Configurability of Dialog’s Advanced Mixed Signal product offerings in target markets
September 23, 2019, SemiWiki, AI inference at the Edge — Architecture and Design
September 23, 2019, Video: Memory Subsystems in Edge Inference Chips
September 20, 2019, EE Times on AI Hardware Summit
September 18, 2019, AI Hardware Summit, Cheng Wang’s Presentation on from TOPS to Throughput: How to get more throughput from less hardware
September 18, 2019, TheNextPlatform, ARM embraces BFloat16 [already available on nnMAX/InferX X1]
September 6, 2019, Electronic Engineering Journal, Amelia’s Weekly Fish Fry, 2nd half is Interview with Geoff Tate on Inference and eFPGA
September 5, 2019, SemiEngineering.com, eFPGA Macros Deliver Higher Speeds from Less Area/Resources
August 28, 2019, TechiExpert.com, New initiatives for high computing applications begin, eFPGA
August 1, 2019, SemiConductor Engineering, AI Inference Memory System Tradeoffs: TOPS isn’t all you need to know about an inference chip.
22 July, 2019, TechCrunch, Powering the Brains of Tomorrow’s Intelligent Machines
10 July, 2019, Semiconductor Engineering, Efficient AI Inference
1 July 2019, EENews Europe, ResNet-50, a misleading machine learning benchmark for megapixel images
2 July 2019, Semiconductor Engineering, TOPS, Memory, Throughput and Inference Efficiency
27 June 2019, Embedded Computing Design, Evolution of eFPGA
6 June 2019, SemiEngineering, Accelerating Endpoint Inferencing
6 June 2019, SemiEngineering.com, Do Large Batch Sizes Always Improve Neural Network Throughput?
5 June 2019, SemiEngineering.com Geoff Tate talks about Improving the Efficiency of Inference Hardware
4 June 2019, Cheng Wang’s Presentation at AI Hardware Summit Beijing on InferX http://flex-logix.com/wp-content/uploads/2019/06/AI-HW-Summit-Asia-2019.pdfX1 – In Mandarin
3 June 2019, D&R Interview with CEO Geoff Tate at DAC
June 1, 2019, Semiconductor Engineering, How to Integrate an Embedded FPGA
Semiconductor Engineering, 23 May, 2019, How to Improve the Efficiency of Inference Accelerators: Video with Cheng Wang
Semiconductor Engineering, 8 May, 2019, Neural Network Performance Modeling Software, How to build an inference chip on the edge
April 29, 2019, New Electronics: Inference at the Edge
April 25, 2019, SemiEngineering.com: The Case for Embedded FPGAs Strengthens and Widens
April 22, 2019, Electronic Design: Top Four Misconceptions About Neural Inferencing
April 16, 2019, EE Journal: Flex Logix Accelerates Edge Inference
April 15, 2019, SemiEngineering: Multi-Layer Processing Boosts Inference Throughput/Watt
April 12, 2019, Microprocessor Report: Flex Logix Moves into Chips, InferX X1 Coprocessor Targets Neural-Network Inference in Edge Servers
April 12, 2019, SemiWiki, Real Time Object Recognition for Automotive Applications
April 11, 2019, Electronics Weekly: Flex Logix Introduces Inference Engine
April 10, 2019, VentureBeat: Flex Logix Launches Inference CoProcessor for Edge AI
April 10, 2019, AnandTech: AI on the Edge: New Flex Logix X1 Inference AI Chip for Fanless Designs
April 10, 2019, EE Times: AI Inferencing Chip Targets Edge Servers
April 10, 2019, Press Release, Flex Logix Launches InferX™ X1 Edge Inference Co-Processor
April 12, 2019, SemiWiki: Real Time Object Recognition for Automotive Applications
March 11, 2019, SemiEngineering.com, Cheng Wang on The Winograd Transformation to Accelerator Convolutions in Inference Models.
February 8, 2019, SemiEngineering.com, Benchmarking Edge Inference Accelerators.
February 7, 2019, SemiEngineering.com, Use Inference Benchmarks Similar to Your Application: How the Wrong Benchmark Can Lead to Incorrect Conclusions
January 30, 2019, Embedded Computing Design, Taking the “Top” off TOPS in Inferencing Engines
January 29, 2019, EE TimesThe Four Characteristics of an Optimal Inferencing Engine
January 21, 2019, MorningCore Technology Licenses Flex Logix’ eFPGA for TSMC12FFC
January 10, 2019, SemiEngineering.com, Edge Inferencing Challenges.
January 7, 2019, SemiEngineering.com, Lies, Damn Lies and TOPS/Watt: Questions you need to ask to make sure you understand AI hardware performance.
January 7, 2019, SemIsrael.com, Lies, Damn Lies and TOPS/Watt.
December 31, 2018, SemiEngineering.com, Top Tech Videos of 2018, including Cheng Wang’s “Inferencing in Hardware”
December 20, 2018, SemiWiki, AI at the Edge
December 6, 2018, SemiEngineering.com, High Neural Inferencing Throughput at Batch=1
December 6, 2018, SemiEngineering.com: Looking Beyond the CPU
December 11, 2018, AI Edge Summit: Updated Technical Slides on NMAX Architecture.
November 29, 2018, Edge AI Summit: Interview with Geoff Tate re NMAX Inferencing
November 16, 2018, EE Times, Silicon 60 Class of 2018 (includes Flex Logix)
November 8, 2018, Electronic Design, Entering a New Robotics Age with Machine Learning.
November 6, 2018, ZDNet, AI Startup Flex Logix touts vastly higher performance than Nvidia
November 5, 2018, Microprocessor Report, Flex Logix Spins Neural Accelerator: NMAX Aims for Data-Center-Class Inference Acceleration.
November 2, 2018, EE Times China, AI从云端转向边缘，新架构应运而生
November 2, 2018, Electronics Weekly, Flex Logix neural inference engine
November 1, 2018, Electronic Design, Flex Logix Takes an FPGA Approach to AI.
November 1, 2018, SemiWiki, Architecture for Machine Learning Applications at the Edge
November 1, 2018, Semi Engineering, Real Time Object Recognition At Low Cost/Power/Latency
November 1, 2018, Datanami, Inference Engine Aimed at AI Edge Apps.
October 31, 2018, IEEE Spectrum, Flex Logix Says It Has Solved Deep Learning’s DRAM Problem.
October 31, 2018, VentureBeat, Flex Logix unveils neural inferencing engine for AI in datacenters and on the edge
October 31, 2018, EE Times, New Architectures Bringing AI to the Edge
October 31, 2018, Linley Processor Conference Slides: NMAX: A High-Performance Reconfigurable Neural Accelerator with Low DRAM Bandwidth
October 15, 2018, Semiwiki, Avionics and Embedded FPGA IP.
October 15, 2018, Flex Logix to Demonstrate Modular eFPGA at ARM Techcon: enables FPGA acceleration code to be portable across SoCs without ne need to change, integrate or re-compile Verilog Source Code. See the MODULAR eFPGA PAGE.
October 9, 2018, TSMC OIP, eFPGA Performance Modelling & Silicon Correlation.
October 3, 2018, EE Times, Boeing Embraces Embedded FPGA.
September 21, 2018, SemiWiki: Neural Network Efficiency with eFPGA.
September 12, 2018, New Electronics: Will the attractions of embedded FPGA overcome traditional cost objections and finally see accelerated growth?
September 6, 2018, SemiEngineering.com: Flexible, Energy-Efficient Neural Network Processing at 16nm
August 30, 2018, EE Times: Harvard takes AI to new low for IoT
August 23, 2018, EE Times China, Flex Logix：eFPGA开发板促进eFPGA应用
August 16, 2018, Electronic Engineering Journal, Where’s the CNN Synthesis?
August 12, 2018, EE Times China, Flex Logix：eFPGA开发板促进eFPGA应用
August 6, 2018, Semiconductor Engineering, Video Interview: eFPGA for Neural Networks.
August 6, 2018, Embedded Systems Engineering, Optimizing AI and Machine Learning with eFPGAs.
August 3, 2018, Circuit Cellar, FPGA Solutions Evolve to Meet AI Needs (link opens PDF of the august issue; article is on page 43 of the PDF)
August 2, 2018, SemiEngineering, First Public Disclosure on the use of eFPGA in an SoC.
June 13, 2018, Electronics Weekly, Getting the measure of the eFPGA market.
July 18, 2018, SemiWiki, Machine Learning and Embedded FPGA IP.
July 20, 2018, SemiEngineering Roundtable, Architecting for AI.
July 9, 2018, SemiEngineering, FPGAs (and eFPGAs) Drive Deeper Into Cars.
July 19, 2018, Tech Forum, Embedded FPGA Starts to Take Hold in SoCs.
July 20, 2018, Electronic Engineering Journal, Programmable Pile of Parts.
July 10, 2018, Semiconductor Engineering, Reconfigurable AI Building Block for SoCs and MCUs.
July 9, 2018, Semiconductor Engineering, Physical Design Considerations in selecting eFPGA (VIDEO).
July 2, 2018, Electronic Design, How to Validate Embedded FPGA.
June 29, 2018, Electronic Design, Neural Network Hardware Drives the Latest Machine-Learning Craze.
June 26, 2018, Electronics Weekly, DAC: eFPGA core is optimized for AI
June 26, 2018, For Listeners of Amelia Dalton’s Interview with Geoff Tate: Directions for a Pub-to-Pub Walk of 58 Miles on the Thames Path, England
June 26, 2018, Flex Logix & Sandia Labs Presentations at DAC on eFPGA
June 21, 2018, EDN, Embedded FPGA: How to compare & benchmark.
June 20, 2018, EE Times China, 新eFPGA核为40至180nm工艺提高可重配置逻辑密度
June 12, 2018, Embedded.com, Selecting and Benchmarking Embedded eFPGAs.
June 6, 2018, SemiEngineering.com, Architects: How to Get the Most Out of eFPGA.
June 6, 2018, SemiEngineering.com, Video on Performance Benchmarking of eFPGA.
June 4, 2018, SemiEngineering.com, FPGAs Becoming More SoC-Like: Lines blur as programmability as added into ASICs.
May 22, 2018, SemiWiki, RAM Integration in an eFPGA.
May 18, 2018, EEWeb.com, Considerations Regarding Benchmarking eFPGAs.
May 16, 2018, EE Times China, FLEX LOGIX联合创始人王成诚获美国专利局颁发的RAMLinx互连专利
May 7, 2018, Electronic-Lab.com: Taking Advantage of eFPGA.
May 4, 2018, SemiEngineer.com: Video of Cheng Wang discussing Timing Signoff for eFPGA.
May 4, 2018, SemiEngineering.com: Timing Signoff Methodology for eFPGA.
April 29, 2018, SemiWiki: Virtual Arrays, Hard IP for an eFPGA.
April 10, 2018, D&R IP-SOC Silicon Valley Presentation: eFPGA Virtual Array Architecture.
April 10, 2018, CDNLive Presentation: Silicon-Correlated Voltus Power Signoff of Embedded FPGA IPs on Advanced FinFET Nodes.
April 5, 2018, SemiEngineering.com: Introduction to eFPGA Software.
February 26, 2018, Semiwiki, The Hierarchical Architecture of an Embedded FPGA.
February 26, 2018, EE News Europe, CEO Interview: Flex Logix’ Geoff Tate on Licensing eFPGA.
February 14, 2018, Electronic Products: 2018 The Year of the Embedded FPGA.
February 15, 2018, DataCenter Journal: Embedded FPGA, Coming to a Data Center Near You.
February 12, 2018, The Information: Amazon is Becoming an AI Chip Maker, May Be Integrating eFPGA.
February 12, 2018, SemiEngineering: Interview with Flex Logix CEO, The Race to Accelerate.
February 1, 2018, SemiEngineering: Introduction to eFPGA Hardware.
January 30, 2018, SemiWiki: Adapting an embedded FPGA for Aerospace Applications.
January 23, 2018, EE Journal, EFPGA Goes Mainstream.
January 22, 2018: Israeli Semiconductor Consortium Licenses Flex Logix’s Embedded FPGA Technology.
January 18, 2018, EnterpriseTech.com, Accelerating and Reconfigurating Data Centers with eFPGA.
January 5, 2018, Electronic Design: Embedded FPGA Under the Hood.
January 4, 2018, Semiconductor Engineering: The Importance of Metal Stack Compatibility for Semi IP.
December 27, 2017, Electronic Products: Six High-Tech Companies to Watch in the New Year.
December 22, 2017, SemiWiki: The Year of the eFPGA, 2017 Recap – embedding RAM in eFPGA
December 21, 2017, All About Circuits: SiFive DesignShare Program.
December 19, 2017, Embedded Computing Design: Using Embedded FPGA as a Reconfigurable Accelerator.
December 19, 2017, Programmable Logic Holds the Key to Addressing Device Obsolence. [applies to eFPGA as well]
December 14, 2017, SemiEngineering: Tony Kozacuzk discussing reconfigurable Accelerators.
December 8, 2017, SemiEngineering: “Get eFPGA with your CPU Now”
December 4, 2017, DataCenter Dynamics: Future-Proofing the Data Center with eFPGAs.
November 30, 2017, Electronics Weekly: Why Lattice Doesn’t License eFPGA.
November 27, 2017: Flex Logix Co-Founder Cheng Wang Awarded Three FPGA Interconnect Patents. MANDARIN: 美国专利局颁发给FLEX LOGIX 公司联合创始人王成诚博士三项FPGA 互连的专利
November 16, 2017, EE Times: The Future of Microcontrollers.
November 12, 2017, EE Times: Silicon 60: Startups to Watch
November 13, 2017, All About Circuits: SiFive Adds Flex Logix eFPGA IPs to DesignShare Initiative
November 10, 2017, EE Times China: 嵌入式FPGA IP要火了，芯片设计工程师如何选择？
November 10, 2017, EDN China: 浅谈eFPGA市场的各大玩家&商业模式&设计挑战
November 8, 2017, SemiWiki: DesignShare is all About Enabling Design Wins!
November 7, 2017, SemiEngineering.com: eFPGA IP Density, Portability & Scalability.
November 3, 2017, SemiEngineering.com: TechTalk video by Cheng Wang on 6-input-LUTs.
November 2, 2017, SemiAccurate.com: Flex Logix joins SiFive’s DesignShare Program.
November 2, 2017, Semiconductor Engineering: New Interconnect Makes eFPGA Dense and Portable.
November 1, 2017, EE News Europe: SiFive signs Flex Logix for low-cost eFPGA fabric.
November 1, 2017, New Electronics: SiFive, Flex Logix look to boost custom silicon starts.
November 1, 2017, Electronics Weekly: Flex Logix makes eFPGA available for SiFive designs.
October 31, 2017, Design & ReUse: Flex Logix to Provide Embedded PGA IP to ‘DesignShare’ for SiFive Freedom Platform.
October 31, 2017, EE Times China: Flex Logix向SiFive Freedom平台的DesignShare计划提供嵌入式FPGA IP
October 31, 2017: Flex Logix向SiFive Freedom 平台的DesignShare计划提供嵌入式FPGA IP.
October 26, 2017, Semiconductor Engineering: Evolution of the MCU.
October 25, 2017, SemiWiki: Timing Analysis for Embedded FPGAs.
October 25, 2017, Electronics Weekly: Flex Logix Puts eFPGA on MCU.
October 24, 2017, EE Times: Flex Logix Demonstrates Flexible MicroController at ARM TechCon
October 24, 2017, Flex Logix Demonstrates Flexible Microcontrollers at ARM TechCon.
October 16, 2017, Chip Design: Embedded FPGAs Offer SoC Flexibility.
October 6, Embedded Systems Engineering: ARM Bus Reconfigurable Accelerators with Embedded FPGA.
October 5, Semiconductor Manufacturing & Design: Embedded FPGAs offer SoC Flexibility.
September 11, Semiconductor Engineering: How to Make Autonomous Vehicles Reliable.
September 8, SemiWiki.com, Embedded FPGA IP as a Post-Silicon Debugger.
September 7, Semiconductor Engineering, A Chip For All Seasons.
September 5, EE Times, Embedded FPGA Suppliers Joins TSMC IP Alliance.
September 5, Electronics Weekly, Flex Logix joins TSMC IP Alliance Program.
September 5, EE Times China, Flex Logix加入台积电IP联盟计划
September 5, Flex Logix Joins TSMC IP Alliance Program.
August 22, Electronic Design: The Advantages of Embedded FPGA for Aerospace and Defense.
August 16, Data Center Knowledge: Embedded FPGA: Coming to a Data Center Near You.
August 14, Embedded Computing Design: Interfacing embedded FPGAs with ARM buses.
July 2017, COTS Journal: FPGA: It’s all About Integration.
July 27, Semiconductor Engineering: The Secret Life of Accelerators.
July 20, 2017, SemiWiki: Embedded FPGA as Functional Accelerators.
July 18, 2017, Electronic Design: How to Take Advantage of Embedded FPGA.
July 13, 2017, Semiconductor Engineering: Is the IP Industry Healthy?
June 20, 2017, Nikkei Electronics: 6入力LUT採用の第2世代FPGAコア、Flex Logixが発表
June 19, 2017, EE Times Asia: An FPGA Array of Many Sizes.
June 16, 2017, EE Times China: Flex Logix: SoC新玩法：嵌入式FPGA来了（视频）
June 6, 2017, Electronic Engineering Journal: Flex Logix Fires Second Salvo, Challenging FPGAs on AI Applications.
June 6, 2017, EE Times: Harvard Researchers Select Flex Logix’s Embedded FPGA Technology to Design Deep Learning SoCs.
June 5, 2017, Electronics Weekly, Flex Logix eFPGA IP chosen for Harvard 16nm deep learning IC.
June 5, 2017, New Electronics: Harvard chooses embedded FPGA for deep learning chip.
May 31, 2017, SemiWiki: Embedded FPGA IP Update — 2nd generation architecture, TSMC 16FFC, and a growing customer base.
May 31, 2017, Electronics Weekly: Flex Logix eFPGA cores enable 100K LUTs.
May 30, 2017, Circuit Cellar: The Future of Embedded FPGAs.
May 30, 2017, Embedded Computing Design: Five Minutes with Geoff Tate, CEO, Flex Logix.
May 22, 2017, SemiWiki: The eFPGA Market is Heating Up!
May 8, 2017, EE News: FPGA fabric startup raises $5 million.
May 8, 2017, VentureBeat: Flex Logix Technologies Raises $5 Million to Make Chip Design More Flexible.
May 8, 2017, Electronic Design: Flex Logix Raises $5M for Embedded FPGA.
May 8, 2017, Electronics Weekly: Flex Logix Raises $5M Series B.
May 8, 2017: Flex Logix Raises $5M in Series B Funding.
April 16, 2017, SemIsrael: The Embedded FPGA Advantage to Designing Chips.
April 5, 2017, IP SoC India Conference: Interview with Abhijit Abhyankar, VP Silicon Engineering.
March 19, 2017, SemiWiki: What’s better than silicon-proven IP? Lab bench proven!
March 16, 2017, Electronic Engineering & Product World China: 为何说嵌入式FPGA改变了芯片和SoC的未来设计方式
March 13, 2017, Electronic Design: 11 Myths About Embedded FPGAs.
February 22, 2017, SemiWiki: Power and Performance Optimization for Embedded FPGA’s.
February 6, 2017, Electronics Weekly: Flex Logix qualifies cores from CAST and SoC Solutions.
January 31, 2017, Embedded Systems Engineering: Extending Battery Life in IoT Devices.
January 30, 2017, Embedded Computing Design: 2017 embedded processor report: At the edge of Moore’s Law and IoT.
January 26, 2017, Defense Systems: DARPA licenses emerging chip technology.
January 26, 2017, Chip Design: EDA in the year 2017 – Part 2 [embedded FPGA predictions]
January 26, 2017, Electronic Products: DARPA teams with Flex Logix to develop FPGA technology for government agencies designing ICs [NOTE: its actually for any company or agency designing ICs for use by the US government]
January 24, 2017, Chip Design: Make Chips Do More & Last Longer with Embedded FPGA
January 23, 2017, SemiWiki: DARPA, Flex Logix and TSMC!
January 23, 2017, SemiAccurate: Flex Logix Announces a First Customer, DARPA.
January 23, 2017, EE Times: Flex Logix Signs Licensing Deal with DARPA.
January 23, 2017, Electronics Weekly: Flex Logix Signs eFPGA Deal with DARPA.
January 17, 2017, SemiWiki: The Year of the eFPGA
January 3, 2017, All About Circuits: Embedded FPGA: Changing the Way Chips are Designed
December 19, 2016, EDACafe: Flex Logix & TSMC: embedded FPGA cores on 16nm FinFETs
December 13, 2016, Electronic Engineering Journal: Future Proofing your FinFET Design.
December 13, 2016, SemiWiki: Flex Logix is a Different Kind of IP Company!
December 13, 2016, Electronics Weekly: Flex Logix completes 16nm eFPGA core design.
December 13, 2016, EE Times Europe: FPGA fabric offered for TSMC 16nm FinFET.
December 8, 2016, EE Times: ACE Awards [Flex Logix’ EFLX co-finalist with Intel and TI: great company to be in]
December 5, 2016, EE Times: Can FPGA Fabric and an SoC Co-Exist on the Same Chip?
December 1, 2016, REUSE2016 Keynote Talk: Embedded FPGA for Architects & Physical Designers.
December 1, 2016, Electronics Weekly: Flex Logix’ switchable LUT blocks for SoCs
December 1, 2016, Electronics Weekly: Multiple Vendors Pursue eFPGA
November 30, 2016, EE Times: Make SoCs flexible with embedded FPGA
November 24, 2016, EE Times: The MCU Guy’s introduction to FPGAs: The Hardware [4 parts]
November 16, 2016, Chip Design: Microcontroller Architects Look to Embedded FPGAs for Flexibility.
November 15, 2016, Electronic Design: 2016’s Embedded Technology Highlights.
November 9, 2016, SemiWiki: One chip and the MCU variant challenge disappears.
November 5, 2016, EDACafe: Interview with Geoff Tate, CEO, Flex Logix at ARM TechCon.
November 4, 2016, 2016 ACE Awards Finalists: Flex Logix Embedded FPGA IP Core is a finalist in the MPU/MCU/FPGA category along with Intel & TI!
November 3, 2016, EE Times: 10 Intriguing Technologies from ARM TechCon, #5 Embedded FPGA.
November 4, 2016, EE Journal: Long Live the King – eFPGAs Reign Supreme, Interview with Flex Logix CEO Geoff Tate.
October 31, 2016, Semiconductor Engineering: The Battle to Embed the FPGA.
October 27, 2016, Semiconductor Engineering: Embedded FPGAs Going Mainstream? [NOTE: Mr. Wingard of Sonics says that embedded FPGA, like FPGA chips, want the largest number of metal layers a foundry can provide. However, EFLX embedded FPGAs only require 4-6 metal layers making them compatible with chips using the minimum metal stack!]
October 26, 2016: Embedded Systems Engineering: Microcontroller Architects turn to embedded FPGA for flexibility.
October 24, 2016, Embedded Systems Engineering: Flex Logix mentioned in See the Latest Developments at ARM TechCon.
October 14, 2016, SemiWiki: Adding Reconfigurable DSP hardware shrinks energy for MCU core.
October 14, 2016, Electronic Design: Q&A with Cheng Wang on Embedded FPGA.
October 10, 2016, SemiWiki: CEO Interview, Geoff Tate of Flex Logix.
October 5, 2016, SemiWiki: Microsoft, FPGAs, and the Evolution of the DataCenter.
September 26, 2016: Application Note, EFLX: Energy Efficient Embedded FPGA for DSP Applications
September 26, 2016: EDACafe, The Tate Effect: Confidence in Flex Logix Team & Technology
September 19, 2016: EE Times names Flex Logix as one of 2016’s Emerging Companies to watch
September 9, 2016, FPL 2016: Microsoft, (Re)Configurable Clouds and the Dawn of a New Era.
September 9, 2016, FPL 2016: Intel Xeon+FPGA Accelerating DataCenter Workloads.
September 9, 2016, EE Times: Data Centers Dominate FPGA Event.
September 1, 2016: EETimes, Embeddable FPGA IP Saves Re-Spins in Chip Design
August 29, 2016: EETimes Europe: FPGA cores offered for TSMC’s 40ULP process
August 29, 2016: Semiwiki, Flex Logix validating EFLX on TSMC 40ULP
August 8, 2016: Tony Kozaczuk joins as Director of Solutions Architecture
August 1, 2016: Pierre Lamond joins Flex Logix’s Board of Directors
December 1, 2015: Abhijit Abhyankar joins Flex Logix as VP Silicon Engineering
November 20, 2015: EDA Cafe interview of Cheng Wang, VP Engineering, at ARM TechCon
October 30, 2015 SemiAccurate, Flex Logix embeds small FPGAs in designs
October 26, 2015: VentureBeat: Flex Logix raises $7.4M to commercialize its clever flexible chip designs
October 26, 2015: eWeek, Flex Logix Raises $7.4M in Funding
October 26, 2015: Flex Logix Press Release: Flex Logix Secures $7.4M in VC Financing
October 13, 2015: Design News, A Solution to fight MCU complexity: hardware programmable logic
October 2, 2015 EE Times: Put FPGAs in Your SoCs
September 25, 2015 EE Times: MCU Vendors Add DSP for Consumer Wireless Apps
September 8, 2015 EE Times Startups to Watch: Flex Logix on the list
Company launches from stealth with founders receiving prestigious Lewis Award for Outstanding Paper at ISSCC.
Led by Founding Rambus CEO Geoff Tate, Flex Logix is backed by Series A led by Lux Capital
Mountain View, CA, February 23, 2015—Flex Logix Technologies, a pioneer in technology that lets chips change, today introduced EFLX, an innovative FPGA (field programmable gate array) core that allows chip makers and equipment manufacturers to update normally fixed functions in silicon at will. The company’s technology platform enables significant new customer benefits by dramatically reducing design and manufacturing risks, accelerating technology roadmaps and bringing greater flexibility to hardware.
Flex Logix is also proud to announce that co-founders Cheng C. Wang, Fang-Li Yuan and UCLA professor of electrical engineering Dejan Markovic have received the prestigious Lewis Award for Outstanding Paper at the International Solid State Circuits Conference (ISSCC), one of the world’s premier chip design conferences, for a paper1 outlining concepts embodied in EFLX. Recent Lewis Award winners include IBM, Toshiba, Nvidia and Sandisk. Other groundbreaking research unveiled at ISSCC include some of the first papers on digital signal processors (Bell Labs, 1980), RISC processors (UC Berkeley, Stanford, 1984) and 1 GHz processors (Intel, 2000).
EFLX is a fully-functional FPGA that, instead of existing in systems as a standalone chip, is integrated into communications chips, microcontrollers and other devices. EFLX cores can be used to upgrade I/O protocols, change encryption algorithms to improve security, enable elements of software-defined radio or accelerate data center algorithms like search. EFLX can be leveraged by manufacturers or end-users to upgrade new products or individual systems already installed in the field.
EFLX FPGA cores can fit into chips selling for hundreds of dollars to less than one dollar.
“We give people a way to change their silicon without changing their silicon,” said Geoff Tate, Flex Logix CEO and co-founder. “FPGA technology has been employed for years in markets where performance requirements are stringent and real-world uses are unpredictable. With EFLX cores, we can bring what’s great about FPGAs to a broader spectrum of customers and users.”
Flex Logix will license EFLX and associated software technology to semiconductor manufacturers. Tate is a recognized leader in semiconductor IP licensing. Prior to Flex Logix, he served as CEO of Rambus for 15 years, leading the company from a four-person startup to a publicly-held company with a market capitalization of over $2 billion dollars. Before that, Tate was a senior vice president at AMD responsible for microprocessors. Lux Capital is the lead Series A investor in Flex Logix.
FPGAs and Flex Logix
Flex Logix’s goal is to empower chip designers and their customers to push the boundaries of performance and technology with far less risk. Over the past several years, chip design costs have been rising sharply, according to analyst reports. Developing new mask, or circuit pattern, to upgrade a single chip can cost $2 million to $5 million. Missing product cycles because of design or technology issues can mean millions in lost revenue. Similarly, end-users often have to replace equipment or endure sub-optimal performance because of unanticipated in-field conditions.
A growing $5 billion market, standalone FPGAs allow hardware to adapt to new demands and technologies, but they add substantial cost: a large percentage are employed in higher-end markets like aerospace, automotive and medical imaging. FPGAs consist of identical circuit blocks connected through an intricate network: increasing their performance typically means increasing costs and board space.
Flex Logix cores are based around a unique hierarchical network that reduces the length of communication links between logic blocks, a breakthrough achieved by co-founder Cheng Wang and explained in the award-winning ISSCC paper. This innovative network architecture reduces overall power consumption and improves performance. It also reduces the area required for interconnects by 50% or more and the number of metal layers, which in turn allows EFLX cores to be integrated into other devices. Standalone FPGAs cannot be easily retrofitted for integration.
Flex Logix has begun to offer its first core, a 2,500-LUT core design in TSMC’s mainstream 28 nanometer HPM process, to manufacturers through licensing contracts. An individual 2,500-LUT (look up table) core is expected to add less than 15 cents to the total manufacturing cost of a device. Designers will also integrate multiple EFLX cores: EFLX cores can be integrated into multiple circuit blocks in the same design or tiled together to create arrays of 7 x 7 or more EFLX cores for greater performance. Flex Logix will also develop smaller EFLX cores that will cost fractions of a cent as well as EFLX cores with more LUTs to serve a greater number of applications. The company is in discussions with a number of companies, especially in communications and networking.
“Flex Logix has the potential to dramatically reshape the semiconductor industry,” said Peter Hebert, co-founder and Managing Partner of Lux Capital. “Adaptable silicon is a really big idea – and we’re proud to be behind Geoff and his team as they bring their breakthrough to market. If we’re successful, billions of new integrated chips will be based on Flex Logix’s innovative EFLX technology.”
1. The paper—“A Multi-Granularity FPGA with Hierarchical Interconnects for Efficient and Flexible Mobile Computing”—was authored by Cheng C. Wang, Fang-Li Yuan, Tsung-Han Yu and Dejan Markovic.